Patent AT-E401767-T1: [Translated] SURFACE TREATED COPPER FOIL AND PRODUCTION THEREOF AND COPPER CLADDED LAMINATE THEREOF

The invention provides a surface-treated copper foil for producing printed wiring boards whose surface has,,been subjected to nodular treatment and anti-corrosion treatment, wherein the anti-corrosion treatment includes forming a-zinc-copper-tin ternary alloy anti-corrosive plating layer on a surface of the copper foil; forming an electrolytic chromate layer on the anti-corrosive plating layer; forming a silane-coupling-agent-adsorbed layer on the electrolytic chromate layer; and drying the copper foil for 2-6 seconds such that the copper foil reaches 105° C.-200° C.