Patent AT-E401767-T1: [Translated] SURFACE TREATED COPPER FOIL AND PRODUCTION THEREOF AND COPPER CLADDED LAMINATE THEREOF
Description
The invention provides a surface-treated copper foil for producing printed wiring boards whose surface has,,been subjected to nodular treatment and anti-corrosion treatment, wherein the anti-corrosion treatment includes forming a-zinc-copper-tin ternary alloy anti-corrosive plating layer on a surface of the copper foil; forming an electrolytic chromate layer on the anti-corrosive plating layer; forming a silane-coupling-agent-adsorbed layer on the electrolytic chromate layer; and drying the copper foil for 2-6 seconds such that the copper foil reaches 105° C.-200° C.
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Access the complete Patent AT-E401767-T1: [Translated] SURFACE TREATED COPPER FOIL AND PRODUCTION THEREOF AND COPPER CLADDED LAMINATE THEREOF on the official website. |
https://pubchem.ncbi.nlm.nih.gov/patent/AT-E401767-T1 |
Tags
- patent
- chemistry
- research
- innovation
- pubchem