Patent AT-E401766-T1: [Translated] MULTI-LAYER METALIZED COMPOSITE ON POLYMER FILM PRODUCT AND METHOD

Description

A composite substrate material useful for fabricating printed circuits is provided comprising a polymeric film having at least one surface modified by plasma etching, a first thin metal nitride layer, a thin second metal nitride layer, and an electrically conductive third metal layer.

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21 Access the complete Patent AT-E401766-T1: [Translated] MULTI-LAYER METALIZED COMPOSITE ON POLYMER FILM PRODUCT AND METHOD on the official website. https://pubchem.ncbi.nlm.nih.gov/patent/AT-E401766-T1

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  • patent
  • chemistry
  • research
  • innovation
  • pubchem

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