Description
A composite substrate material useful for fabricating printed circuits is provided comprising a polymeric film having at least one surface modified by plasma etching, a first thin metal nitride layer, a thin second metal nitride layer, and an electrically conductive third metal layer.
Resources
| Name | Format | Description | Link |
|---|---|---|---|
| Official Data Source | HTML | Access the complete Patent AT-E401766-T1: [Translated] MULTI-LAYER METALIZED COMPOSITE ON POLYMER FILM PRODUCT AND METHOD on the official website. | Open resource |