Patent AT-E400895-T1: [Translated] LOW TEMPERATURE RADIATION IMAGING APPARATUS WITH CUPS BONDING
Description
An x-ray and gamma-ray radiant energy imaging device is disclosed having a temperature sensitive semiconductor detector substrate bump-bonded to a semiconductor CMOS readout substrate. The temperature sensitive, semiconductor detector substrate utilizes Tellurium compound materials, such as CdTe and CdZnTe. The bump bonds are formed of a low-temperature, lead-free binary solder alloy having a melting point between about 100° C. and about 180° C. Also described is a process for forming solder bumps utilizing the low-temperature, lead-free binary solder alloy, to prevent damage to temperature sensitive and potentially brittle detector substrate when assembling the imaging device.
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Access the complete Patent AT-E400895-T1: [Translated] LOW TEMPERATURE RADIATION IMAGING APPARATUS WITH CUPS BONDING on the official website. |
https://pubchem.ncbi.nlm.nih.gov/patent/AT-E400895-T1 |
Tags
- patent
- chemistry
- research
- innovation
- pubchem