Description
A method of making an abrasive article for wafer planarization, the method comprising providing an abrasive coating composition, providing a backing having a first major surface, said surface having a first portion and a second portion, and bringing the backing into contact with the abrasive coating composition, so that the abrasive coating composition substantially adheres only to the first portion of the backing.
Resources
| Name | Format | Description | Link |
|---|---|---|---|
| Official Data Source | HTML | Access the complete Patent AT-E400405-T1: [Translated] METHOD FOR PRODUCING A GRINDING ARTICLE on the official website. | Open resource |