Patent AT-E400395-T1: [Translated] SOLDER PASTES
Description
A solder paste comprising a powder of a Zn-containing Sn-based, lead-free solder mixed with an activator-containing rosin-based flux to which 0.5 - 10.0 wt% of isocyanuric acid or a haloalkyl ester thereof is added can prevent the formation of solder balls and voids during reflow soldering and exhibit good solderability. A solder paste comprising a powder of an Ag- or Zn-containing Sn-based, lead-free solder mixed with an activator-containing rosin-based flux to which 0.01 - 10.0 wt% of a salicylamide compound also does not exhibit a change in viscosity and exhibits good solderability.
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Access the complete Patent AT-E400395-T1: [Translated] SOLDER PASTES on the official website. |
https://pubchem.ncbi.nlm.nih.gov/patent/AT-E400395-T1 |
Tags
- patent
- chemistry
- research
- innovation
- pubchem