Patent AT-E399806-T1: [Translated] ONE-COMPONENT THERMOSET EPOXY RESIN COMPOSITION AND BACKING MATERIAL FOR SEMICONDUCTOR ASSEMBLY
Description
The present invention provides an one-pack thermosetting type epoxy resin composition which is useful as an underfilling material used when a flip chip or a semiconductor package comprised of a semiconductor element held on a carrier base being mounted onto a wiring substrate; which can omit a fluxing process as adopted for improvement of the bonding force of bumps or solder balls particularly at said mounting and exhibits a good voidless property even at a reflow temperature; and which can be also applied as an adhesive, a paint, a coating material, a sealing material, or the like. The one-pack thermosetting type epoxy resin composition of the present invention comprises as essential ingredients, a liquid epoxy resin and a carboxylic acid having two or more carboxylic groups in molecule as a curing agent.
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Access the complete Patent AT-E399806-T1: [Translated] ONE-COMPONENT THERMOSET EPOXY RESIN COMPOSITION AND BACKING MATERIAL FOR SEMICONDUCTOR ASSEMBLY on the official website. |
https://pubchem.ncbi.nlm.nih.gov/patent/AT-E399806-T1 |
Tags
- patent
- chemistry
- research
- innovation
- pubchem