A Non-galvanic D-band MMIC-to-Waveguide Transition Using eWLB Packaging Technology-dataset

Description

This paper presents a novel D-band interconnect implemented in a low-cost embedded Wafer Ball Grid Array (eWLB) commercial process. The transition is realized through a patch slot antenna directly radiating to a standard waveguide opening. The interconnect achieves low insertion loss and good bandwidth. The measured minimum Insertion Loss (IL) is 2 dB and the average is 3 dB across a bandwidth of 22% covering the frequency range 110-138 GHz. In addition, the structure is easy to integrate as it does not require any special assembly nor any galvanic contacts. Adopting the low-cost eWLB process and standard waveguides makes the transition an attractive solution for interconnects beyond 100 GHz.

Resources

Name Format Description Link
0 http://data.europa.eu/88u/dataset/oai-zenodo-org-822283
0 http://data.europa.eu/88u/dataset/oai-zenodo-org-822283
0 http://data.europa.eu/88u/dataset/oai-zenodo-org-822283
0 http://data.europa.eu/88u/dataset/oai-zenodo-org-822283
0 http://data.europa.eu/88u/dataset/oai-zenodo-org-822283
0 http://data.europa.eu/88u/dataset/oai-zenodo-org-822283
0 http://data.europa.eu/88u/dataset/oai-zenodo-org-822283
0 http://data.europa.eu/88u/dataset/oai-zenodo-org-822283
0 http://data.europa.eu/88u/dataset/oai-zenodo-org-822283
0 http://data.europa.eu/88u/dataset/oai-zenodo-org-822283

Tags

  • ewlb
  • d-band
  • interconnects
  • millimeter-waves
  • waveguide-transition,

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