Torsional strength of electropolished microscale copper wires

This project has received funding from the EU's Horizon 2020 research and innovation programme under the Marie SklodowskaCurie grant agreement No. 704292 (TORWIRE). The data have been included in the paper "Song Guo, Yuming He, Jian Lei, Zhenkun Li, and Dabiao Liu. Individual Strain Gradient Effect on Torsional Strength of Electropolished Microscale Copper Wires. Scripta Materialia, 130 (2017), 124-27." These data can be used to validate existing theories for microscale plasticity, e.g. strain gradient plasticity theories, critical thickness theory, etc.