Name |
Format |
Description |
Link |
|
48 |
(a) 3D design of broadside-coupled CPWs and associated two-port network model of the interconnect. (b) Cross-sectional geometry of the translucent plane in (a). Distributed circuit model in the conductor representation (c) and modal representation (d) for N=2 coupled lines. |
https://data.nist.gov/od/ds/mds2-2773/Fig1.tif |
|
53 |
Fig3_TableI_Data.xlsx |
https://data.nist.gov/od/ds/mds2-2773/Fig3_TableI_Data.xlsx |
|
53 |
Fig2_Data.xlsx |
https://data.nist.gov/od/ds/mds2-2773/Fig2_Data.xlsx |
|
48 |
Interconnect transmission (S_12) predicted by full-wave simulations (red curves) and our analytical, parameter-free, two-mode model (dashed curves) for l_c= 500 µm (a), 250 µm (b), 125 µm (c), and 60 µm (d). The transmission band maxima (f_n) and bandwidth (?f_n) increase as the coupling length decreases. |
https://data.nist.gov/od/ds/mds2-2773/Fig3.tif |
|
48 |
Conductor-representation distributed circuit parameters of resistance (a), inductance (b), conductance (c) and capacitance (d) per unit length. |
https://data.nist.gov/od/ds/mds2-2773/Fig2.tif |
|
47 |
A readme document for data submitted for "A distributed theory for contactless interconnects at terahertz frequencies“. |
https://data.nist.gov/od/ds/mds2-2773/README.txt |