Cure Kinetics of Advanced Epoxy Molding Compound Using Dynamic Heating Scan

Description

The data are associated with figures in R. Tao, S. P. Phansalkar, A. M. Forster, B. Han, Investigation of Cure Kinetics of Advanced Epoxy Molding Compound Using Dynamic Heating Scan: An Overlooked Second Reaction, 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), Orlando, Florida, May 30 - June 2, 2023. https://doi.org/10.1109/ECTC51909.2023.00225

Resources

Name Format Description Link
47 2948_README.txt https://data.nist.gov/od/ds/mds2-2948/2948_README.txt
53 Figure%201%20ECTC.xlsx https://data.nist.gov/od/ds/ark:/88434/mds2-2948/Figure%201%20ECTC.xlsx
47 https://data.nist.gov/od/ds/ark:/88434/mds2-2948/Figure%201%20ECTC.xlsx.sha256
47 https://data.nist.gov/od/ds/ark:/88434/mds2-2948/Figure%202%20ECTC.xlsx.sha256
53 Figure%203%20ECTC.xlsx https://data.nist.gov/od/ds/ark:/88434/mds2-2948/Figure%203%20ECTC.xlsx
47 https://data.nist.gov/od/ds/ark:/88434/mds2-2948/Figure%203%20ECTC.xlsx.sha256
53 Figure%204%20ECTC.xlsx https://data.nist.gov/od/ds/ark:/88434/mds2-2948/Figure%204%20ECTC.xlsx
47 https://data.nist.gov/od/ds/ark:/88434/mds2-2948/Figure%206%20ECTC.xlsx.sha256
47 https://data.nist.gov/od/ds/ark:/88434/mds2-2948/Figure%207%20ECTC.xlsx.sha256
53 Figure%208%20ECTC.xlsx https://data.nist.gov/od/ds/ark:/88434/mds2-2948/Figure%208%20ECTC.xlsx
47 https://data.nist.gov/od/ds/ark:/88434/mds2-2948/Figure%208%20ECTC.xlsx.sha256
47 https://data.nist.gov/od/ds/ark:/88434/mds2-2948/Figure%204%20ECTC.xlsx.sha256
53 Figure%205%20ECTC.xlsx https://data.nist.gov/od/ds/ark:/88434/mds2-2948/Figure%205%20ECTC.xlsx
53 Figure%206%20ECTC.xlsx https://data.nist.gov/od/ds/ark:/88434/mds2-2948/Figure%206%20ECTC.xlsx
53 Figure%202%20ECTC.xlsx https://data.nist.gov/od/ds/ark:/88434/mds2-2948/Figure%202%20ECTC.xlsx
53 Figure%207%20ECTC.xlsx https://data.nist.gov/od/ds/ark:/88434/mds2-2948/Figure%207%20ECTC.xlsx
47 https://data.nist.gov/od/ds/ark:/88434/mds2-2948/Figure%205%20ECTC.xlsx.sha256

Tags

  • differential-scanning-calorimetry
  • heat-of-reaction
  • thermosets
  • thermal-gravimetric-analysis
  • advanced-packaging
  • glass-transition
  • semiconductors
  • filled-polymers

Topics

Categories