Description
The data are associated with figures in R. Tao, S. P. Phansalkar, A. M. Forster, B. Han, Investigation of Cure Kinetics of Advanced Epoxy Molding Compound Using Dynamic Heating Scan: An Overlooked Second Reaction, 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), Orlando, Florida, May 30 - June 2, 2023. https://doi.org/10.1109/ECTC51909.2023.00225
Resources
| Name | Format | Description | Link |
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| MS Excel File | XLS | Figure%201%20ECTC.xlsx | Open resource |
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| MS Excel File | XLS | Figure%202%20ECTC.xlsx | Open resource |
| Text File | Text | Open resource | |
| MS Excel File | XLS | Figure%203%20ECTC.xlsx | Open resource |
| Text File | Text | Open resource | |
| MS Excel File | XLS | Figure%204%20ECTC.xlsx | Open resource |
| Text File | Text | Open resource | |
| MS Excel File | XLS | Figure%205%20ECTC.xlsx | Open resource |
| Text File | Text | Open resource | |
| MS Excel File | XLS | Figure%206%20ECTC.xlsx | Open resource |
| Text File | Text | Open resource | |
| MS Excel File | XLS | Figure%207%20ECTC.xlsx | Open resource |
| Text File | Text | Open resource | |
| MS Excel File | XLS | Figure%208%20ECTC.xlsx | Open resource |
| Text File | Text | Open resource | |
| README | Text | 2948_README.txt | Open resource |