Advanced Characterization of the Cure Kinetics of a Liquid Encapsulant

Description

The data are associated with figures in A. P. Kotula, R. Tao, J. Tu, Y. Lee, G. A. Holmes, Advanced Characterization of the Cure Kinetics of a Liquid Encapsulant, 2025 IEEE 75th Electronic Components and Technology Conference (ECTC), Dallas, Texas, May 27 - 30, 2025.

Resources

Name Format Description Link
53 Figure%202-Conversion.xlsx https://data.nist.gov/od/ds/mds2-3702/Figure%202-Conversion.xlsx
53 Figure%203-Residue%20heat.xlsx https://data.nist.gov/od/ds/mds2-3702/Figure%203-Residue%20heat.xlsx
53 Figure%204-FTIR%20spectra.xlsx https://data.nist.gov/od/ds/mds2-3702/Figure%204-FTIR%20spectra.xlsx
53 Figure%206-Raman%20spectra.xlsx https://data.nist.gov/od/ds/mds2-3702/Figure%206-Raman%20spectra.xlsx
53 Figure%207-Rheo-Raman%20data.xlsx https://data.nist.gov/od/ds/mds2-3702/Figure%207-Rheo-Raman%20data.xlsx
47 https://data.nist.gov/od/ds/ark:/88434/mds2-3702/3702_README.txt.sha256
53 Figure_5-Normalized_IR_absorbance.xlsx https://data.nist.gov/od/ds/ark:/88434/mds2-3702/Figure_5-Normalized_IR_absorbance.xlsx
47 https://data.nist.gov/od/ds/ark:/88434/mds2-3702/Figure_5-Normalized_IR_absorbance.xlsx.sha256
53 Figure%201-Conversion%20rate.xlsx https://data.nist.gov/od/ds/mds2-3702/Figure%201-Conversion%20rate.xlsx
47 3702_README.txt https://data.nist.gov/od/ds/ark:/88434/mds2-3702/3702_README.txt

Tags

  • microelectronics-encapsulation
  • optoelectronics
  • advanced-packaging
  • chips-metrology
  • cure-kinetics
  • rheology

Topics

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